-
1
-
-
0027262140
-
High-Density Area Array Module Connector
-
IEEE
-
Chapin, F. W., Kershaw, J. J., and Knight, A. D., 1993, “High-Density Area Array Module Connector,” Proceedings of the 43rd Electronic Components and Technology Conference, IEEE, pp. 441-445.
-
(1993)
Proceedings of the 43Rd Electronic Components and Technology Conference
, pp. 441-445
-
-
Chapin, F.W.1
Kershaw, J.J.2
Knight, A.D.3
-
2
-
-
0026618383
-
Packaging technology for the NEC ACOS System 3900
-
IEEE
-
Yamada, M., Nishiyama, M., Tokaichi, T., and Okano, M., 1992, “Packaging technology for the NEC ACOS System 3900,” Proceedings of the 42nd Electronic Components and Technology Conference, IEEE, pp. 745-751.
-
(1992)
Proceedings of the 42Nd Electronic Components and Technology Conference
, pp. 745-751
-
-
Yamada, M.1
Nishiyama, M.2
Tokaichi, T.3
Okano, M.4
-
3
-
-
0039825988
-
Trends in High Performance Connector Requirements
-
Cahner Exposition Group
-
Gillet, J. B., 1991, “Trends in High Performance Connector Requirements,” Proceedings of the Technical Program-NEPCON East’91, pp. 255-261, Cahner Exposition Group.
-
(1991)
Proceedings of the Technical Program-Nepcon East’91
, pp. 255-261
-
-
Gillet, J.B.1
-
5
-
-
0003860827
-
-
Van Nostrand Rheinhold, New York
-
Tummala, R. R., and Rymaszewski, E. J., 1989, Microelectronics Packaging Handbook, Van Nostrand Rheinhold, New York.
-
(1989)
Microelectronics Packaging Handbook
-
-
Tummala, R.R.1
Rymaszewski, E.J.2
-
6
-
-
0004019060
-
-
McGraw-Hill, New York
-
Seraphim, D. P., Lasky, R. C., and Li, C.-Y., 1989, Principles of Electronic Packaging, McGraw-Hill, New York.
-
(1989)
Principles of Electronic Packaging
-
-
Seraphim, D.P.1
Lasky, R.C.2
Li, C.-Y.3
-
7
-
-
0026771677
-
Shrinking design space for area array connectors
-
Cahner Exposition Group
-
Gillet, J. B., 1992, “Shrinking design space for area array connectors,” Proceedings of the Technical Program-NEPCON West '92, Vol. 3, pp. 1347-1361, Cahner Exposition Group.
-
(1992)
Proceedings of the Technical Program-Nepcon West '92
, vol.3
, pp. 1347-1361
-
-
Gillet, J.B.1
-
8
-
-
0027273184
-
Structural Optimization of an Electrical Spring Contact
-
IEEE
-
Macek, T., and Pitaressi, J. M., 1993, “Structural Optimization of an Electrical Spring Contact,” Proceedings of the 43rd Electronic Components and Technology Conference, IEEE, pp. 1125-1134.
-
(1993)
Proceedings of the 43Rd Electronic Components and Technology Conference
, pp. 1125-1134
-
-
Macek, T.1
Pitaressi, J.M.2
-
11
-
-
0003997741
-
-
Institute for Systems Research, University of Maryland, College Park, MD 20742
-
Zhou, J. L., Tits, A. L., and Lawerence, C. T., 1996, “User’s Guide for FFSQP Version 3.6: A FORTRAN Code for Solving Constrained Nonlinear (Minimax) Optimization Problems, Generating Iterates Satisfying All Inequality and Linear Constraints,” Institute for Systems Research, University of Maryland, College Park, MD 20742.
-
(1996)
User’s Guide for FFSQP Version 3.6: A FORTRAN Code for Solving Constrained Nonlinear (Minimax) Optimization Problems, Generating Iterates Satisfying All Inequality and Linear Constraints
-
-
Zhou, J.L.1
Tits, A.L.2
Lawerence, C.T.3
|