A reexamination of residualstresses in thin films and of thevalidity of stoney’s estimate

Journal of Electronic Packaging, Transactions of the ASME

Volumn 122, Issue 3, 2000, Pages 267-273

  Hui, C Y ^a   Conway, H D ^a   Lin, Y Y ^a  

^a Cornell University ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0040489192     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.1287930     Document Type: Article

References (19)

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