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Volumn 94, Issue 10, 1996, Pages 10-15

Study of precious metal coatings using sequential electrochemical reduction analysis

Author keywords

[No Author keywords available]

Indexed keywords


EID: 0040372112     PISSN: 00260576     EISSN: None     Source Type: Journal    
DOI: 10.1016/0026-0576(96)85143-9     Document Type: Article
Times cited : (3)

References (15)
  • 1
    • 0040372106 scopus 로고
    • New Application of SERA Method - Assessment of the Protective Effectiveness of Organic Solderability Preservatives
    • June
    • Bratin, P. et al., "New Application of SERA Method - Assessment of the Protective Effectiveness of Organic Solderability Preservatives," Proceedings of AESF SURFIN' 95 Technical Conference, pp. 538-589; June, 1995
    • (1995) Proceedings of AESF SURFIN' 95 Technical Conference , pp. 538-589
    • Bratin, P.1
  • 2
    • 24044487137 scopus 로고
    • Electroless Palladium: A Surface Finish for Interconnect Technology
    • April
    • Milad, G., "Electroless Palladium: A Surface Finish for Interconnect Technology," Proceedings of the IPC Technical Conference, p. P12-3; April, 1995
    • (1995) Proceedings of the IPC Technical Conference
    • Milad, G.1
  • 3
    • 5844299352 scopus 로고
    • PCB Surface Finish
    • October
    • Hwang, J.S., "PCB Surface Finish," SMT Magazine; p. 20-22; October, 1995
    • (1995) SMT Magazine , pp. 20-22
    • Hwang, J.S.1
  • 4
    • 0040966313 scopus 로고    scopus 로고
    • Alternative Metal Finishes for Wire Bond and Soldering Applications
    • March
    • Beigle, S., "Alternative Metal Finishes for Wire Bond and Soldering Applications," Proceedings of the IPC Technical Conference, p. S9-2; March, 1996
    • (1996) Proceedings of the IPC Technical Conference
    • Beigle, S.1
  • 5
    • 0028422134 scopus 로고
    • A Comparison of Electrolytic and Electroless Ni/Au Finishing Process for Multilayer IC Packages
    • Winters, E.D. et al., "A Comparison of Electrolytic and Electroless Ni/Au Finishing Process for Multilayer IC Packages," Plating and Surface Finishing; 81(4):72; 1994
    • (1994) Plating and Surface Finishing , vol.81 , Issue.4 , pp. 72
    • Winters, E.D.1
  • 6
    • 24044538503 scopus 로고
    • Solderability Assessment of Circuit Boards and Lead Finishes
    • August
    • Tench, D.M. et al., "Solderability Assessment of Circuit Boards and Lead Finishes," Proceedings of the SMI Technical Conference, pp. 529-535; August, 1995
    • (1995) Proceedings of the SMI Technical Conference , pp. 529-535
    • Tench, D.M.1
  • 8
    • 0040966315 scopus 로고
    • Solderability Assessment via SERA
    • December
    • Tench, D.M. et al. "Solderability Assessment via SERA," Journal of Applied Electrochemistry 24:46-50; December, 1994
    • (1994) Journal of Applied Electrochemistry , vol.24 , pp. 46-50
    • Tench, D.M.1
  • 9
    • 24044523805 scopus 로고
    • Sequential Electrochemical Reduction Analysis (SERA) Applications on Process Characterization and Trouble-Shooting for Printed Circuit Board Fabrication
    • April
    • Reed, J. and J. Cheng, "Sequential Electrochemical Reduction Analysis (SERA) Applications on Process Characterization and Trouble-Shooting for Printed Circuit Board Fabrication," Proceedings of the IPC Technical Conference, p. P12-2; April, 1995
    • (1995) Proceedings of the IPC Technical Conference
    • Reed, J.1    Cheng, J.2
  • 10
    • 0039187518 scopus 로고    scopus 로고
    • Determination of Type and Thickness of Oxides Using SERA
    • March
    • Bratin, P. et al., "Determination of Type and Thickness of Oxides Using SERA," Proceedings of the IPC Technical Conference, p. S9-6; March, 1996
    • (1996) Proceedings of the IPC Technical Conference
    • Bratin, P.1
  • 11
    • 0000820881 scopus 로고
    • Electrolytic Determination of Porosity in Gold Electroplates I Corrosion Potential Measurements
    • Morrisey, R.J., "Electrolytic Determination of Porosity in Gold Electroplates I Corrosion Potential Measurements," Journal of the Electrochemical Society, 117(6):742-747; 1970
    • (1970) Journal of the Electrochemical Society , vol.117 , Issue.6 , pp. 742-747
    • Morrisey, R.J.1
  • 12
    • 0004953738 scopus 로고
    • Production Validation of SERA Test Method
    • February
    • Tench, D.M. et al., "Production Validation of SERA Test Method," Soldering and Surface Mount Technology, 13:18-29; February, 1993
    • (1993) Soldering and Surface Mount Technology , vol.13 , pp. 18-29
    • Tench, D.M.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.