Time domain analysis of a printed circuit board via

Microwave Journal

Volumn 43, Issue 11, 2000, Pages 76-84

  LaMeres, Brock J ^a   Kalkur, T S ^b  

^a AGILENT TECHNOLOGIES   (United States)

^b University of Colorado at Colorado Springs   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0039600875     PISSN: 01926225     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (6)

1. Glenn R. Blackwell (editor). Circuit Boards, The Electronic Packaging Handbook, CRC Press, 1999.
2. T. Wang, R.F. Harrington and J.R. Mautz, "The Equivalent Circuit of a Via," IEEE Trans. Soc. of Comput. Simulation, Vol. 4, April 1987, pp. 97-123.
3. T. Wang, R.F. Harrington and J.R. Mautz, "Quasi-static Analysis of a Microstrip Via through a Hole in a Ground Plane," IEEE Transactions on Microwave Theory and Techniques, Vol. MTT-36, June 1988, pp. 1008-1013.
4. B.J. LaMeres, "Characterization of a Printed Circuit Board Via," Master's Thesis, University of Colorado, Colorado Springs, CO, May 30, 2000.
5. Fawwaz T. Ulaby, Fundamentals of Applied Electromagnetics, Prentice Hall, NJ, 1997.
6. D. Dascher, "Measuring Parasitic Capacitance and Inductance Using TDR," Hewlett-Packard Journal, April 1996, pp. 83-96.