Development of thermal solutions for high performance laptop computers

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 433-440

  Zhang, H Y ^a   Pinjala, D ^a   Navas, O K ^a   Iyer, M K ^a   Chan, P K ^b   Liu, X P ^b   Hayashi, H ^c   Han, J B ^d  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b DSO NATIONAL LABORATORIES   (Singapore)

^c FUJIKURA LTD   (Japan)

^d AGILENT TECHNOLOGIES   (Singapore)

Author keywords

Application software; Assembly; Flip chip; Heat sinks; High performance computing; Microprocessors; Packaging; Portable computers; Power system modeling; Semiconductor device measurement

Indexed keywords

APPLICATION PROGRAMS; ASSEMBLY; CHIP SCALE PACKAGES; FLIP CHIP DEVICES; HEAT PIPES; HEAT SINKS; LAPTOP COMPUTERS; MICROCOMPUTERS; MICROPROCESSOR CHIPS; PACKAGING; SEMICONDUCTOR DEVICE MODELS; SEMICONDUCTOR DEVICES;

FLIP CHIP; HIGH PERFORMANCE COMPUTING; PORTABLE COMPUTERS; POWER SYSTEM MODEL; SEMICONDUCTOR DEVICE MEASUREMENTS;

SOLUTION MINING;

EID: 0038817901     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012489     Document Type: Conference Paper

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