An experimental study on mechanical, thermomechanical, and opto-mechanical behaviors of holographic materials

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3294, Issue , 1998, Pages 145-151

  Wu, S X ^a   Cheng, C S ^a   Huang, T ^a   Qin, S ^a   Yeh, J ^a   Gao, Q ^a   Chen, A ^a   Yeh, C P ^a   Harton, A ^a   Wyatt, K ^a  

^a MOTOROLA INC   (United States)

Author keywords

Holographic optical elements; Material properties; Photopolymer

Indexed keywords

AGING OF MATERIALS; COMPOSITE STRUCTURES; DELAMINATION; DIFFRACTION; OPTOELECTRONIC DEVICES; PHOTOPOLYMERIZATION; RESIDUAL STRESSES; THERMOMECHANICAL TREATMENT;

HOLOGRAPHIC MATERIALS;

HOLOGRAPHIC OPTICAL ELEMENTS;

EID: 0038801630     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.304509     Document Type: Conference Paper

References (4)

1. Hybrid free space optical system for board-to-board interconnects
2. Characterization of DuPont photopolymers in infrared light for free-space optical interconnects
3. A constitutive model of polyimide films and its integration with finite element analysis for residual stress prediction in thin film interconnects