A comprehensive model for cleaning semiconductor wafers

Solid State Phenomena

Volumn 92, Issue , 2003, Pages 135-138

  Burdick, Gretchen ^a   Eichenlaub, Sean ^a   Berman, Neil ^a   Beaudoin, Stephen ^a  

^a Arizona State University   (United States)

Author keywords

Hydrodynamic detachment; Particle adhesion; Post CMP cleaning

Indexed keywords

ADHESION; COMPOSITION; COMPUTER SIMULATION; DEFORMATION; MATHEMATICAL MODELS; MORPHOLOGY; PARTICLES (PARTICULATE MATTER); REYNOLDS NUMBER; SURFACE CLEANING; SURFACE ROUGHNESS; VAN DER WAALS FORCES; ADHESIVES; PARTICLE SIZE;

ADHESION FORCE; ADHESION MODEL; PARTICLE REMOVAL; REMOVAL MODEL; SURFACE GEOMETRY; ADHESIVE INTERACTION; COMPREHENSIVE MODEL; DEFORMATION CHARACTERISTICS; HYDRODYNAMIC DETACHMENT; PARTICLE ADHESION; PARTICLE REYNOLDS NUMBER; POST-CMP CLEANING; SEMI-CONDUCTOR WAFER;

SILICON WAFERS;

EID: 0038745321     PISSN: 10120394     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/ssp.92.135     Document Type: Conference Paper

References (5)

1. Cooper, K: A Fundamental and Experimental Study into the Adhesion of Micron-Scale Particle to Thin Films (Ph.D. Thesis, Arizona State University 2000).
2. Burdick, G., N. Berman, and S. Beaudoin: J. Nanoparticle Research Vol. 3 (2001), p. 1.
3. Yiantsios, S.G. and A.J. Karabelas: J. Colloid Interface Sci. Vol. 176 (1995), p. 74.
4. Burdick, G., N. Berman, and S. Beaudoin: J. Electrochem. Soc. (in press).
5. Burdick, G., N. Berman, and S. Beaudoin: J. Electrochem. Soc. (in review).