Electroelastic analysis of an internal interface crack in a half-plane consisting of two bonded dissimilar piezoelectric quarter-planes

Meccanica

Volumn 38, Issue 3, 2003, Pages 309-323

  Li, X F ^a  

^a HUNAN NORMAL UNIVERSITY   (China)

Author keywords

Antiplane deformation; Energy release rate; Interface crack; Mechanics of solids; Piezoelectric material

Indexed keywords

CRACKS; DEFORMATION; ELASTICITY; ELECTRIC LOADS; INTEGRAL EQUATIONS; INTERFACES (MATERIALS); MAGNETIC PERMEABILITY; MECHANICS; PIEZOELECTRIC MATERIALS; SHEAR STRENGTH;

ANTIPLANE DEFORMATION; ANTIPLANE SHEAR; ELECTROELASTIC ANALYSIS; ENERGY RELEASE RATE; IMPLANE ELECTRIC LOADING; INTERNAL FACE CRACK; MECHANICS OF SOLIDS; PIEZOELECTRIC QUARTER PLANES;

DISSIMILAR MATERIALS;

EID: 0038731183     PISSN: 00256455     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1023329710354     Document Type: Article

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