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Volumn 4935, Issue , 2002, Pages 378-385

Silicon sensor integration to form smart sensors

Author keywords

Interconnection; Smart sensors; Very large scale integration VLSI

Indexed keywords

CMOS INTEGRATED CIRCUITS; ETCHING; MICROMACHINING; OPERATIONAL AMPLIFIERS; SCHOTTKY BARRIER DIODES; VLSI CIRCUITS;

EID: 0038640459     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.469077     Document Type: Conference Paper
Times cited : (2)

References (5)
  • 1
    • 0038008710 scopus 로고
    • The Institute and Electronic Engineers, Inc., New York IEEE Press
    • Richard S. Muller, Micro sensors, The Institute and Electronic Engineers, Inc., New York IEEE Press, 1990.
    • (1990) Micro Sensors
    • Muller, R.S.1
  • 2
    • 0038346753 scopus 로고    scopus 로고
    • Center for High Performance Integrated Technologies and Systems, University of Adelaide, accessed September 2002, March
    • Said F. Al-sarawi, "Vertical interconnections in 3D electronics". Center for High Performance Integrated Technologies and Systems, University of Adelaide, (accessed September 2002), www.eleceng.adelaide.edu.au/Personal/alsarawi/Packaging/node28.html, March 1997.
    • (1997) Vertical Interconnections in 3D Electronics
    • Al-Sarawi, S.F.1
  • 3
    • 0041940609 scopus 로고    scopus 로고
    • Conformal coating by photoresist of sharp corners of anisotropically etched through-holes in silicon
    • M. Heschel and S. Bouwstra, "Conformal coating by photoresist of sharp corners of anisotropically etched through-holes in silicon", Sensors and Actuators A, vol. 70, pp. 75-80, 1998.
    • (1998) Sensors and Actuators A , vol.70 , pp. 75-80
    • Heschel, M.1    Bouwstra, S.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.