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Journal of Materials Science Letters

Volumn 22, Issue 7, 2003, Pages 515-518

Effect of process conditions on microstructural development during thermal evaporation of AlSb thin films

(4) Lal, K a Srivastava, A K a Singh, S a Kishore, R a

a NATIONAL PHYSICAL LABORATORY (India)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION; ELECTRIC PROPERTIES; EVAPORATION; FILM GROWTH; MICROSTRUCTURE; PROCESS ENGINEERING; STOICHIOMETRY; SYNTHESIS (CHEMICAL); THERMAL EFFECTS; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

DEPOSITION TEMPERATURE; MICROSTRUCTURAL DEVELOPMENT; PROCESS CONDITIONS; THERMAL EVAPORATION;

ALUMINUM COMPOUNDS;

EID: 0038628991 PISSN: 02618028 EISSN: None Source Type: Journal
DOI: 10.1023/A:1022934302798 Document Type: Article

Times cited : (21)

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