Growth mechanism of PTO on MgO at initial stage

Applied Surface Science

Volumn 216, Issue 1-4 SPEC., 2003, Pages 323-328

  Nishida, K ^a   Shirakata, K ^a   Osada, M ^b   Kakihana, M ^c   Katoda, T ^a  

^a KOCHI UNIVERSITY OF TECHNOLOGY   (Japan)

^b JAPAN SCIENCE AND TECHNOLOGY AGENCY   (Japan)

^c TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Film orientation; Growth mechanism; PTO; Residual stress; Surface roughness

Indexed keywords

CRYSTAL GROWTH; CRYSTALLOGRAPHY; LEAD COMPOUNDS; MAGNESIA; RESIDUAL STRESSES;

FILM ORIENTATION;

PEROVSKITE;

EID: 0038614830     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(03)00455-0     Document Type: Conference Paper

References (18)

1. Burns G., Scott B.A. Phys. Rev. B7:1973;3088.
2. Scott J.F., Araujo C.A. Science. 246:1989;1400.
3. Ohtani K., Okuyama M., Hamakawa Y. Jpn. J. Appl. Phys. 23(Suppl. 23-1):1984;133.
4. Okuyama M., Seto H., Kojima M., Matsui Y., Hamakawa Y. Jpn. J. Appl. Phys. 22(Suppl. 22-1):1983;465.
5. Takayama R., Tomita Y., Iijima K., Ueda I. J. Appl. Phys. 63:1988;5868.
6. Wrigh J.S., Francis L.F. J. Mater. Res. 8:1993;1712.
7. Iijima K., Tomita Y., Takayama R., Ueda I. J. Appl. Phys. 60:1986;361.
8. Maeda M., Ishida H., Soe K.K.K., Suzuki I. Jpn. J. Appl. Phys. 32:1993;4136.
9. Dana S.S., Etzod F.K., Clabes J. J. Appl. Phys. 69:1991;4398.
10. Chen C., Ryder D.F. Jr. J. Am. Ceram. Soc. 72:1989;1495.
11. Imai T., Okuyama M., Hamakawa Y. Jpn. J. Appl. Phys. 30:1991;2163.
12. Kanno I., Kamada T., Hayashi S., Kitagawa M., Hirao T. Jpn. J. Appl. Phys. 32:1993;L950.
13. Kwak B.S., Boyd E.P., Erbil A. Appl. Phys. Lett. 53(18):1988;1702.
14. Li T., Zhu Y., Desu S.B., Peng C.H., Nagata M. Appl. Phys. Lett. 68:1996;616.
15. Bai G.R., Chang H.L.M., Foster C.M., Shen Z., Lam D.J. J. Mater. Res. 9:1994;156.
16. Taguchi L., Pignolet A., Wand L., Proctor M., Levy F., Schmid P.E. J. Appl. Phys. 73:1993;394.
17. Ma W.H., Zhang M.S., Tin Z. J. Korean Phys. Soc. 32:1998;S1137.
18. Burns G., Scott B.A. Phys. Rev. B7:1973;3088.