Time-resolved thermal transport properties by the Picosecond Ultrasonic Technique

Progress in Natural Science

Volumn 6, Issue SPEC. ISS., 1996, Pages

  Bonello, B ^a   Perrin, B ^a   Romatet, E ^a   Gohier, R ^a  

^a SORBONNE UNIVERSITÉ   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC COOLING; ULTRASONIC TESTING;

ELECTRONIC RELAXATION; HEAT DIFFUSION EQUATIONS; PICOSECOND REGIME; PICOSECOND ULTRASONIC TECHNIQUES; PICOSECONDS; SILICON SUBSTRATES; THERMAL BEHAVIOURS; THERMAL TRANSPORT PROPERTIES; THIN-FILMS; TIME-RESOLVED;

TRANSPORT PROPERTIES;

EID: 0038576851     PISSN: 10020071     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (3)

1. C. Thomsen, H.T. Grahn, H.J. Maris, J. Tauc, Phys. Rev. B34, 4129 (1986).
2. S.A. Akhmanov and V.E. Gusev, Sov. Phys. Usp. 35, 153 (1992).
3. O.B. Wright and K. Kawashima, Phys. Rev. Lett. 69, 1668 (1992).