Effect of the substrate bias potential on crystalline grain size, intrinsic stress and hardness of vacuum arc evaporated TiN/c-Si coatings

Thin Solid Films

Volumn 437, Issue 1-2, 2003, Pages 170-175

  Espinoza Beltran F J ^a   Che Soberanis, O ^a   Garcia Gonzalez L ^a   Morales Hernandez J ^b  

^a DEPARTAMENTO DE FÍSICA   (Mexico)

^b UNIVERSIDAD AUTÓNOMA DE QUERÉTARO   (Mexico)

Author keywords

Arc evaporation process; Hard coatings; Size strain analysis; Warren Averbach method

Indexed keywords

CHEMICAL VAPOR DEPOSITION; CRYSTALLINE MATERIALS; ELECTRIC POTENTIAL; EVAPORATION; GRAIN SIZE AND SHAPE; HARDNESS; PHYSICAL VAPOR DEPOSITION; STRESSES; SUBSTRATES; VACUUM APPLICATIONS; X RAY DIFFRACTION ANALYSIS;

BIAS POTENTIAL;

SILICONE COATINGS;

EID: 0038447972     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(03)00568-6     Document Type: Article

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