A new SEM/FIB crossbeam inspection tool for high resolution materials and device characterization

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4980, Issue , 2003, Pages 106-113

  Gnauck, Peter ^a   Hoffrogge, Peter ^a  

^a LEO Elektronenmikroskopie GmbH   (Germany)

Author keywords

Analysis; Deposition; Device modification; Failure analysis; FIB; Inspection; Metrology; SEM; Semiconductor; TEM

Indexed keywords

ATOMIC FORCE MICROSCOPY; ENERGY DISPERSIVE SPECTROSCOPY; FAILURE ANALYSIS; HIGH RESOLUTION ELECTRON MICROSCOPY; METALLOGRAPHIC MICROSTRUCTURE; MILLING (MACHINING); SCANNING ELECTRON MICROSCOPY; SCANNING TUNNELING MICROSCOPY; SECONDARY ION MASS SPECTROMETRY; SEMICONDUCTOR MATERIALS; TRANSMISSION ELECTRON MICROSCOPY; WAVELENGTH DISPERSIVE SPECTROSCOPY;

FOCUSED ION BEAM (FIB);

SURFACE TESTING;

EID: 0038397357     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.476340     Document Type: Conference Paper

References (5)

1. P. Gnauck, V. Drexel, J. Greiser "A new high resolution field emission SEM with variable pressure capabilities" Microscopy and Microanalysis 2002, Long Beach, California, August 5-9, 2001
2. P. Gnauck, J. Greiser: "A new approach to materials characterization using low pressure and low voltage field emission scanning electron microscopy" DVM-Bericht 519, Mühlheim 2000, pp. 89-96.
3. th Int. Congr. on Electron Microscopy ICEM, Vol.1, pp. 67-68.
4. P. Gnauck, P. Hoffrogge, M. Schumann, G. Bauhammer Enhanced Site specific Preparation of SEM Cross Sections and TEM Samples by using CrossBeam Technology Microscopy and Microanalysis 2002, Quebec, Canada, August 5-9, 2002
5. th International Congress on Electron Microscopy ICEM 15 Durban, South Africa September 1-6, 2002