Measurement of mechanical properties of materials in the micrometer range using electronic holographic moiré

Optical Engineering

Volumn 42, Issue 5, 2003, Pages 1215-1222

  Sciammarella, Cesar A ^a   Sciammarella, Federico M ^a  

^a Illinois Institute of Technology   (United States)

Author keywords

Electronic holography; Electronic speckle pattern interferometry; Subject terms: micromechanical measurements

Indexed keywords

COMPOSITE MICROMECHANICS; INTERFEROMETRY; MICROELECTROMECHANICAL DEVICES; MOIRE FRINGES; SPECKLE;

ELECTRONIC HOLOGRAPHY;

HOLOGRAPHY;

EID: 0038380740     PISSN: 00913286     EISSN: None     Source Type: Journal    
DOI: 10.1117/1.1566004     Document Type: Article

References (12)

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