The effects of thermal softening and heat conduction on the dynamic growth of voids

International Journal of Solids and Structures

Volumn 40, Issue 17, 2003, Pages 4461-4478

  Wu, X Y ^a   Ramesh, K T ^a   Wright, T W ^a,b  

^a Johns Hopkins University   (United States)

^b U S ARMY RESEARCH LABORATORY   (United States)

Author keywords

Ductile failure; Dynamic; Instability; Plasticity

Indexed keywords

DUCTILITY; HEAT CONDUCTION; PLASTICITY; STRESS ANALYSIS;

THERMAL SOFTENING;

ELASTICITY;

DUCTILE FRACTURE; FAILURE; HEAT CONDUCTION; VOID;

CONDUCTIVITY; DUCTILITY; FAILURE ANALYSIS; MODELING; VOID;

EID: 0038299586     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0020-7683(03)00214-2     Document Type: Article

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