Modeling of aluminum via filling by forcefill

Journal of Applied Physics

Volumn 93, Issue 9, 2003, Pages 5812-5815

  Estrin, Y ^a   Kim, H S ^b   Kovler, M ^c   Berler, G ^c   Shaviv, R ^c   Rabkin, E ^d  

^a CLAUSTHAL UNIVERSITY OF TECHNOLOGY   (Germany)

^b Chungnam National University   (South Korea)

^c Tower Semiconductor Limited ^*  (Israel)

^d TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MICROSTRUCTURE; PLASTICITY; PRESSURE EFFECTS; THERMAL EFFECTS;

FORCEFILL;

ALUMINUM;

EID: 0038297295     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1565512     Document Type: Article

References (13)

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