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Volumn 29, Issue 12, 1990, Pages 2395-2397

Minimizing wafer surface damage and chamber material contamination in new plasma processing equipment

Author keywords

Contamination; Glow discharge; Ion bombardment; Magnetron; Of plasma; Plasma damage; Plasma potential; Self bias voltage

Indexed keywords


EID: 0038281623     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.29.L2395     Document Type: Article
Times cited : (13)

References (3)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.