Effect of solid-solution W addition on the nanostructure of electrodeposited Ni

Materials Research Society Symposium - Proceedings

Volumn 740, Issue , 2002, Pages 119-124

  Iwasaki, Hajime ^a   Higashi, Kenji ^b   Nieh, T G ^c  

^a UNIVERSITY OF HYOGO   (Japan)

^b Osaka Prefecture University   (Japan)

^c LAWRENCE LIVERMORE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRODEPOSITION; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; MORPHOLOGY; NICKEL; SOLID SOLUTIONS;

NANOGRAINS;

NANOSTRUCTURED MATERIALS;

EID: 0038237983     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-740-i3.28     Document Type: Conference Paper

References (11)

1. R.T.C. Choo, J.M. Toguri, A.M. El-Sharik, U.Erb, Journal of Applied Electrochemistry 25, 384 (1995).
2. H. Natter, M. Schmelzer, R. J. Hempelmann, Mater. Res. 13, 1186 (1998).
3. M.L. Trudeau, Nanostructured Materials 12, 55 (1999).
4. D.L. Grimmett, M. Schwartz, K. Nobe, Journal of the Electrochemical Society 140, 973 (1993).
5. U. Erb, Nanostructured Materials 6, 533 (1995).
6. U. Erb, A.M. El-Sharik, G. Palumbo, K.T. Aust, Nanostructured Materials 2, 383 (1993).
7. A. Inoue, Acta Mater. 48, 279 (2000).
8. T. Yamasaki, R. Tomohira, Y. Ogino, P. Schlossmacher, K. Ehrlich, Plating and Surface Finishing 87, 148(1999).
9. T. Yamasaki, Scripta Mater. 44, 1497 (2001).
10. ASM Handbook: Alloy Phase Diagrams. Vol. 3. 1992, Metals Park, OH: ASM.
11. T. Watanabe, Materialia Japan 40, 871 (2001).