Computer simulation study of the atomistic mechanism of deformation and fracture initiation in thin fcc metal films

Materials Science and Engineering: A

Volumn 350, Issue 1-2, 2003, Pages 238-244

  Shimomura, Y ^a   Kiritani, M ^a   Mukouda, I ^b  

^a HIROSHIMA INSTITUTE OF TECHNOLOGY   (Japan)

^b HIROSHIMA UNIVERSITY   (Japan)

Author keywords

Computer simulation; Copper; Crack initiation; Stacking fault tetrahedral; Thin film elongation; Vacancy generation

Indexed keywords

CRYSTAL STRUCTURE; DEFORMATION; ELASTICITY; MOLECULAR DYNAMICS; NUCLEATION; STRESS ANALYSIS;

EMBEDDED ATOM METHOD (EAM);

METALLIC FILMS;

COPPER; CRACK INITIATION; DEFORMATION; FILM; FRACTURE; MATHEMATICAL MODELING;

EID: 0038209682     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(02)00708-6     Document Type: Article

References (4)

1. M. Kiritani, Y. Satoh, Y. Kizuka, K. Arakawa, Y. Ogasawara, S. Arai, Y. Shimomura, Phil. Mag. Lett. 79 (1999) 797.
2. M.S. Daw, M.I. Baskes, Phys. Rev. B 37 (1988) 6344.
3. Y. Shimomura, K. Sugio, M. Kiritani, Comp. Mater. Sci. 14 (1999) 97.
4. I. Mukouda, Y. Shimomura, M. Kiritani, J. Mater. Sci. Eng. A, this volume.