Finite element simulation of thermal stress during diffusion bonding of Al2O3 ceramic to aluminium

Science and Technology of Welding and Joining

Volumn 8, Issue 2, 2003, Pages 138-142

  Feng, J ^a   Wang, D ^a   Liu, H ^a   Li, Z ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; BONDING; CERAMIC MATERIALS; COMPUTER SIMULATION; COMPUTER SOFTWARE; DIFFUSION; FINITE ELEMENT METHOD; SHEAR STRESS; SINTERING; STRESS RELAXATION; TENSILE STRESS;

THERMOPLASTICITY;

THERMAL STRESS;

EID: 0038177984     PISSN: 13621718     EISSN: None     Source Type: Journal    
DOI: 10.1179/136217103225008838     Document Type: Article

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