On the stability of rapid planar solidification during melt-substrate quenching

Materials Science and Engineering: A

Volumn 226-228, Issue , 1997, Pages 1035-1038

  Wang, G X ^a   Sampath, S ^a   Prasad, V ^a   Herman, H ^a  

^a Stony Brook University   (United States)

Author keywords

Interface stability; Melt undercooling; Melt substrate quenching; Rapid solidification

Indexed keywords

COOLING; COPPER; HEAT FLUX; HEAT TRANSFER; INTERFACES (MATERIALS); LIQUID METALS; MASS TRANSFER; MATHEMATICAL MODELS; QUENCHING; RAPID SOLIDIFICATION; SUBSTRATES;

LINEAR STABILITY ANALYSIS; MELT UNDERCOOLING;

ALUMINUM ALLOYS;

EID: 0038173060     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0921-5093(97)80102-5     Document Type: Article

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