Piezoelectric monitoring of the reliability of adhesive joints

Journal of Adhesion Science and Technology

Volumn 17, Issue 6, 2003, Pages 777-796

  Kwon, Jae Wook ^a   Chin, Woo Seok ^b   Lee, Dai Gil ^b  

^a LG Electronics Inc   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Adhesively bonded joint; In situ reliability monitoring; Joint self sensor; Piezoelectric method

Indexed keywords

CAPACITANCE; COMPOSITE STRUCTURES; CRACK PROPAGATION; ELECTRIC CHARGE; MONITORING; PIEZOELECTRIC MATERIALS; PIEZOELECTRICITY; RELIABILITY; SENSORS; FATIGUE TESTING;

ADHESIVELY BONDED JOINT; JOINT SELF SENSOR; PIEZOELECTRIC MONITORING;

ADHESIVE JOINTS;

ACCURATE ESTIMATION; ADHERENDS; ADHESIVE LAYERS; ADHESIVELY BONDED JOINTS; APPLIED LOADS; EMBEDDED SENSORS; FATIGUE TESTS; IN-SITU; MAXIMUM VALUES; PARALLEL CIRCUITS; PIEZOELECTRIC METHODS; PIEZOELECTRIC PROPERTY; RELIABILITY MONITORING; SELF-SENSOR;

EID: 0038141319     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856103321645158     Document Type: Article

References (20)

1. T. J. Reinhart (Ed.), in: Composites, Vol. 1, pp. 479-495. ASM International, Metals Park, OH (1987).
2. J. R. Vinson and R. L. Sierakowshi, in: The Behavior of Structures Composed of Composite Materials, pp. 239-283. Martinus Nijhoff Publishers (1987).
3. A. J. Kinloch, in: Adhesion and Adhesives, pp. 2-3, 18-55. Chapman and Hall (1987).
4. P. K. Mallick, in: Fiber-Reinforced Composites, pp. 417-425. Marcel Dekker, New York (1988).
5. J. J. Bikerman, in: The Science of Adhesive Joints, 2nd edn, pp. 309-316. Academic Press (1968).
6. R. D. Adams and N. A. Peppiatt, J. Adhesion 9, 1-18 (1977).
7. S. J. Lee and D. G. Lee, J. Adhesion 56, 157-169 (1996).
8. J. W. Kwon and D. G. Lee, J. Adhesion Sci. Technol. 14, 1085-1102 (2000).
9. B. Tang, J. Mommaerts, R. K. Duncan, J. C. Duke, Jr. and D. A. Dillard, Experimental Mechanics 33, 102-109 (1993).
10. G. L. Anderson, R. C. Robertson, B. L. Peterson and D. A. Dillard, Experimental Mechanics 34, 194-201 (1994).
11. P. Salvini, E. Scardecchia and G. Demofonti, Fatigue and Fracture of Engineering Materials and Structures 20, 1117-1128 (1997).
12. V. Giurgiutiu, A. Reynolds and C. A. Rogers, J. Intelligent Material System and Structures 10, 802-812 (1999).
13. G. Park, D. E. Muntges and D. J. Inman, Key Engineering Materials 204, 75-84 (2001).
14. D. G. Lee, K. S. Kim and Y. T. Lim, J. Adhesion 35, 39-53 (1991).
15. J. K. Choi and D. G. Lee, J. Adhesion 48, 235-250 (1995).
16. S. J. Lee and D. G. Lee, J. Adhesion 40, 1-14 (1992).
17. J. H. Choi and D. G. Lee, J. Adhesion 55, 245-260 (1996).
18. D. G. Lee, K. S. Jeong and J. H. Choi, J. Adhesion 49, 37-56 (1995).
19. D. G. Lee, J. W. Kwon and D. H. Cho, J. Adhesion Sci. Technol. 12, 1253-1275 (1998).
20. T. Ikeda, Fundamentals of Piezoelectricity. Oxford University Press, Oxford (1996).