Electroless pure nickel plating process with continuous electrolytic regeneration system

Surface and Coatings Technology

Volumn 169-170, Issue , 2003, Pages 132-134

  Nakao, Seiichiro ^a   Kim, Dong Hyun ^a   Obata, Keigo ^a   Inazawa, Sinji ^b   Majima, Masatoshi ^b   Koyama, Keiji ^b   Tani, Yoshie ^b  

^a Daiwa Fine Chemicals Co Ltd   (Japan)

^b SUMITOMO ELECTRIC INDUSTRIES LTD   (Japan)

Author keywords

Electroless plating; Electrolytic regeneration; Pure nickel; Trivalent titanium ion

Indexed keywords

AMINO ACIDS; CHELATION; ELECTROLYTES; INDUCTIVELY COUPLED PLASMA; METALLIC FILMS; NICKEL;

CHELATING AGENTS;

ELECTROPLATING;

COATING; ELECTROLESS PLATING; ELECTROLYTE; NICKEL; SURFACE TREATMENT;

EID: 0038130878     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(03)00193-2     Document Type: Article

References (4)

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3. Senda A. Nakagawa T. Takano Y. Kasanami T. J. Sur. Fin. Soc. Jpn. 43 1992 324
4. Vaskelis A. Norkus H.J. Rozovskis G. Vinkevicius H.J. Trans. Inst. Met. Fin. 75 1997 1