High-rate deposition of YBa2Cu3O7-x films by hot cluster epitaxy

Journal of Applied Physics

Volumn 84, Issue 9, 1998, Pages 5084-5088

  Takamura, Yuzuru ^a,b   Yamaguchi, Norio ^a   Terashima, Kazuo ^a   Yoshida, Toyonobu ^a  

^a UNIVERSITY OF TOKYO   (Japan)

^b JAPAN AEROSPACE EXPLORATION AGENCY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0038105961     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.368757     Document Type: Article

References (17)

1. Thermal Plasma Applications in Materials and Metallurgical Processing, edited by N. ElKaddah (The Minerals, Metals & Materials Society, Warrendale, Pennsylvania, 1992).
2. K. Terashima, K. Eguchi, T. Yoshida, and K. Akashi, Appl. Phys. Lett. 52, 1274 (1988).
3. K. Terashima, T. Akagi, H. Komaki, and T. Yoshida, J. Appl. Phys. 71, 3427 (1992).
4. Y. Hirokawa, Y. Takamura, H. Komaki, K. Terashima, and T. Yoshida, J. Mater. Synth. Process. 1, 53 (1993).
5. S. Yuhya, K. Kikuchi, Y. Shiohara, K. Terashima, and T. Yoshida, J. Mater. Res. 7, 2673 (1992).
6. Y. Takamura, K. Hayasaki, K. Terashima, and T. Yoshida, Plasma Chem. Plasma Process. 16, 141S (1996).
7. K. Hayasaki, Y. Takamura, N. Yamaguchi, K. Terashima, and T. Yoshida, J. Appl. Phys. 81, 1222 (1997).
8. Y. Takamura, K. Hayasaki, K. Terashima, and T. Yoshida, J. Vac. Sci. Technol. B 15, 558 (1997).
9. T. Hattori, N. Yamaguchi, K. Terashima, and T. Yoshida, Proceedings of the 13th International Symposium on Plasma Chemistry Beijing, 1997, Vol. III, p. 1065.
10. W. K. Burton, N. Cabrera, and F. C. Frank, Philos. Trans. R. Soc. London, Ser. A 243, 299 (1950).
11. M. Schieber and Y. Ariel, Appl. Phys. Lett. 61, 970 (1992).
12. C. S. Chern et al., Appl. Phys. Lett. 58, 185 (1991).
13. D. G. Schlom, D. Anselmetti, J. G. Bednorz, Ch. Gerber, and J. Mannhart, J. Cryst. Growth 137, 259 (1994).
14. W. Kossei, Naturwissenschaften 18, 901 (1930).
15. D. Walton, J. Chem. Phys. 37, 2182 (1962).
16. S. Williams et al., J. Appl. Phys. 72, 4798 (1992).
17. R. Kromann et al., J. Appl. Phys. 71, 3419 (1992).