Mechanisms of particle removal from silicon wafer surface in wet chemical cleaning process

Journal of Colloid and Interface Science

Volumn 261, Issue 2, 2003, Pages 569-574

  Qin, Kuide ^a   Li, Yongcheng ^b  

^a University of Florida   (United States)

^b GE Plastics   (United States)

Author keywords

Critical etch depth; Particle removal; Particle surface interaction; Silicon wafer cleaning

Indexed keywords

CLEANING; ETCHING; OPTIMIZATION; SURFACE CHEMISTRY;

REPULSIVE INTERACTIONS;

SILICON WAFERS;

SILICON;

ARTICLE; CALCULATION; CHEMICAL INTERACTION; CHEMICAL PROCEDURES; CLEANING; PARTICULATE MATTER; PRIORITY JOURNAL; QUANTITATIVE ANALYSIS; SURFACE PROPERTY; THEORY;

EID: 0038068124     PISSN: 00219797     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0021-9797(03)00053-5     Document Type: Article

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