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Volumn 172, Issue 1, 2003, Pages 79-89
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Electrochemically deposited nickel membranes; process-microstructure-property relationships
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Author keywords
Electrodeposition; Mechanical testing; Microstructure; Nickel; Thin films
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Indexed keywords
ATOMIC FORCE MICROSCOPY;
DUCTILITY;
HARDNESS TESTING;
INDENTATION;
METAL FOIL;
METALLOGRAPHIC MICROSTRUCTURE;
MORPHOLOGY;
SCANNING ELECTRON MICROSCOPY;
SURFACES;
TENSILE TESTING;
TEXTURES;
TRANSMISSION ELECTRON MICROSCOPY;
X RAY DIFFRACTION ANALYSIS;
NANOINDENTATION;
ELECTRODEPOSITION;
FILM;
MECHANICAL PROPERTY;
MEMBRANE;
MICROSTRUCTURE;
NICKEL;
SURFACE TREATMENT;
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EID: 0038018134
PISSN: 02578972
EISSN: None
Source Type: Journal
DOI: 10.1016/S0257-8972(03)00253-6 Document Type: Article |
Times cited : (11)
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References (26)
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