High frequency modeling and characterization of pin and land grid array sockets

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 1264-1269

  Han, Dong Ho ^a   Prokofiev, Victor ^a   Leigh, Wojewoda ^a   Polka, Lesley ^a   Ruttan, Thomas ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; COMPUTER PERIPHERAL EQUIPMENT; COMPUTER SIMULATION; ELECTRIC NETWORK ANALYZERS; FINITE ELEMENT METHOD; INSERTION LOSSES;

DIFFERENTIAL FREQUENCY RESPONSE; LAND GRID ARRAY SOCKETS; PIN GRID ARRAY SOCKETS; SOCKET ADAPTOR; VECTOR NETWORK ANALYZER;

ELECTRONIC EQUIPMENT TESTING;

EID: 0038012341     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Young, B., Digital Signal Integrity - Modeling and Simulation with Interconnects and Packages, Prentice-Hall (New York, 2001), pp. 42-53.
2. Figueroa, D.G.; Chee Yee Chung; Cornelius, M.D.; Teong Guan Yew; Yuan-Liang, Li; "High performance socket characterization technique for microprocessors," Electrical Performance of Electronic Packaging 1999 pp. 125-128
3. Bockelman, D.E.; Eisenstadt, W.R.; Stengel, R.; "Accuracy estimation of mixed-mode scattering parameter measurements," IEEE Transactions on, Volume: 47 Issue: 1, Jan 1999 102-105