Morphological stability of copper-silver multilayer thin films at elevated temperatures

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 34 A, Issue 5, 2003, Pages 1043-1054

  Knoedler, H Ludtke ^a,b   Lucas, G E ^c   Levi, C G ^a  

^a University of California   (United States)

^b SKYWORKS SOLUTIONS INC   (United States)

^c UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; COPPER; DIFFUSION; GRAIN BOUNDARIES; GRAIN GROWTH; INTERFACES (MATERIALS); LAMINATES; MICROSTRUCTURE; MULTILAYERS; SILICON; THIN FILMS;

MICROLAMINATES;

POLYCRYSTALLINE MATERIALS;

EID: 0037973276     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-003-0125-x     Document Type: Article

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