Reticle defect printability: Their impact on yield and feedback to suppliers

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4889, Issue 1, 2002, Pages 271-282

  Vinje, Robert ^a   Klaum, Arthur D ^b   Chmielewski, David ^a   Lamantia, Matthew J ^c   Woolery, Dawn M ^a   Coburn, Dianna L ^a   Weins, Colleen P ^c  

^a CYPRESS SEMICONDUCTOR   (United States)

^b KLA TENCOR CORPORATION   (United States)

^c DuPont Photomasks Inc   (United States)

Author keywords

Defects; Feedback; Photolithography; Positional correlation; Printability; Reticles; Yield correlation

Indexed keywords

INSPECTION; MASKS; PHOTORESISTS;

RETICLE DEFECT PRINTABILITY;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0037965993     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.468087     Document Type: Article

References (3)

1. Defect Dispositioning in a Reticle Qualification Process - Mark Hawkins, Motorola Inc.; Art Klaum, KLA-Tencor Corporation - SPIE Bacus Proceedings, October, 2001
2. Formation and Detection of Sub-Pellicle Defects by Exposure to DUV System Illumination - Brian J. Grenon, Grenon Consulting, Inc.; Charles R. Peters, Dominion Semiconductor; Kaustave Bhattacharyya and William Volk, KLA-Tencor Corporation - SPIE Bacus Proceedings, September, 1999
3. Cost Effective Reticle Quality Management Strategies in Wafer Fabs - Vince Samek, Barbara Shiffler, Wanda Tomlinson, IBM Microelectronics, Burlington, VT; Dadi Gudmundsson*, Jim Merritt, Raman K. Nurani, KLA-Tencor Corporation; J. George Shanthikumar, IEOR Department, University of California, Berkeley, CA