Thermal stress cleaving of brittle materials by laser beam

CIRP Annals - Manufacturing Technology

Volumn 51, Issue 1, 2002, Pages 149-152

  Ueda, T ^a   Yamada, K ^a   Oiso, K ^a   Hosokawa, A ^a  

^a KANAZAWA UNIVERSITY   (Japan)

Author keywords

Fracture; Laser beam machining; Temperature

Indexed keywords

BRITTLENESS; CRACK PROPAGATION; MACHINING; NEODYMIUM LASERS; OPTICAL FIBERS; SILICON WAFERS; THERMAL STRESS;

THERMAL STRESS CLEAVING;

LASER BEAMS;

EID: 0037838818     PISSN: 00078506     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0007-8506(07)61487-5     Document Type: Article

References (7)

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5. 2 Laser, Annals of the CIRP, Vol.46/1:117-122.
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7. H.P.Kirchner, R.M.Gruver, D.M.Richard, 1979, Fragmentation and Damage Penetration During Abrasive Machining of Ceramics, The Science of Ceramic Machining and Surface Finishing II, NBS S.P. 562:23-42.