Finite element analysis of thermal residual stress in ceramic functional graded material: Interface optimization for residual reduction

Materials Science Forum

Volumn 423-425, Issue , 2003, Pages 677-680

  Hou, Likun ^a   Pan, Wei ^a   Wang, Reigang ^a   Xie, Dan ^a  

^a TSINGHUA UNIVERSITY   (China)

Author keywords

Composition profiles; Elastic; FEA; Heat pressed

Indexed keywords

CERAMIC MATRIX COMPOSITES; COMPUTER SIMULATION; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); MATHEMATICAL MODELS; OPTIMIZATION; RESIDUAL STRESSES; SINTERING; STRESS CONCENTRATION; THERMAL STRESS;

INTERFACE OPTIMIZATION; SOFTWARE PACKAGE ABAQUS; THERMAL RESIDUAL STRESS;

FUNCTIONALLY GRADED MATERIALS;

EID: 0037793278     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.423-425.677     Document Type: Conference Paper

References (5)

1. T. Hirai and L. Chen: Mater. Sci. Forum Vol. 308-311 (1999) pp.509-514.
2. R.L. Williamson, B.H. Rabin and J.T. Drake: J. Appl. Phys. 74 (1993), pp. 1310-1320.
3. R.L. Williamson, B.H. Rabin and J.T. Drake: J. Appl. Phys. 74 (1993), pp. 1321-1326.
4. M. Grujicic and H. Zhao: Mater. Sci. Engi. Vol. A252 (1998), pp.117-132.
5. I. Tamura, Y. Tomota and H. Ozawa: Proceedings (the Third International Conference on Strength of Metal and Iron and Steel Institute, London, 1973), pp.611.