Alternatives to reduce perfluorinated compound (PFC) emissions from semiconductor dielectric etch processes: Meeting environmental commitments while minimizing costs

IEEE International Symposium on Electronics and the Environment

Volumn , Issue , 2003, Pages 19-24

  Krishnan, Nikhil ^a   Smati, Rafika ^b   Raoux, Sebastien ^b   Dornfeld, David ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b APPLIED MATERIALS INC   (United States)

Author keywords

Design for environment (DFE); Environmental management systems; Global climate change; Perfluorinated compounds (PFC's); Semiconductor manufacturing

Indexed keywords

CARBON DIOXIDE; CHEMICAL VAPOR DEPOSITION; DIELECTRIC MATERIALS; ENVIRONMENTAL IMPACT; ETCHING; GLOBAL WARMING; HYDROCARBONS; SEMICONDUCTOR DEVICE MANUFACTURE; SILICA;

COPPER INTERCONNECT TECHNOLOGY; DESIGN FOR ENVIRONMENTAL TOOL; ENVIRONMENTAL MANAGEMENT SYSTEM; GLOBAL WARMING POTENTIAL; PERFLUORINATED COMPOUND EMISSION; SEMICONDUCTOR DIELECTRIC ETCH PROCESS;

GAS EMISSIONS;

EID: 0037675826     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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