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Volumn 216, Issue 1-4 SPEC., 2003, Pages 2-7
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The National Si-Soft Project
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Author keywords
Electronics design; Si Soft; Taiwan electronics industry
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Indexed keywords
ECONOMICS;
ELECTRIC EQUIPMENT;
ELECTRONICS INDUSTRY;
ELECTRONICS PACKAGING;
INTEGRATED CIRCUITS;
MANUFACTURE;
MARKETING;
INTEGRATED CIRCUIT (IC) PACKAGING;
SEMICONDUCTING SILICON;
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EID: 0037670157
PISSN: 01694332
EISSN: None
Source Type: Journal
DOI: 10.1016/S0169-4332(03)00477-X Document Type: Conference Paper |
Times cited : (7)
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References (5)
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