The equivalence of moisture and temperature in physical aging of polymeric composites

Journal of Composite Materials

Volumn 37, Issue 10, 2003, Pages 913-928

  Hu, H ^a   Sun, C T ^a  

^a Purdue University   (United States)

Author keywords

Creep compliance; Elastic compliance; Moisture; Physical aging; Polymeric composites; Temperature

Indexed keywords

AGING OF MATERIALS; CREEP TESTING; ELASTICITY; MOISTURE; THERMAL EFFECTS;

MOISTURE EFFECTS; PHYSICAL AGING; POLYMERIC COMPOSITES;

NONMETALLIC MATRIX COMPOSITES;

EID: 0037646839     PISSN: 00219983     EISSN: None     Source Type: Journal    
DOI: 10.1177/0021998303037010004     Document Type: Article

References (10)

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