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Journal of Applied Physics

Volumn 93, Issue 10 3, 2003, Pages 8253-8255

Micromagnetic behavior of electrodeposited Ni/Cu multilayer nanowires

(3) Chen, M a Searson, P C a Chien, C L b

a Johns Hopkins University (United States)

b JOHNS HOPKINS UNIVERSITY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; COERCIVE FORCE; COPPER; DEMAGNETIZATION; ELECTRODEPOSITION; FERROMAGNETIC MATERIALS; MAGNETIC HYSTERESIS; MAGNETIC MOMENTS; MAGNETIC PROPERTIES; MAGNETIZATION; MAGNETOMETERS; MULTILAYERS; NICKEL; POROUS MATERIALS; REMANENCE; TRANSMISSION ELECTRON MICROSCOPY;

NANOWIRES;

NANOSTRUCTURED MATERIALS;

EID: 0037641240 PISSN: 00218979 EISSN: None Source Type: Journal
DOI: 10.1063/1.1556136 Document Type: Conference Paper

Times cited : (64)

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