Process monitoring of etched fused silica phase shift reticles

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4889, Issue 1, 2002, Pages 25-31

  Brooks, Cynthia B ^a   Buie, Melisa J ^a   Waheed, Nabila L ^b   Martin, Patrick M ^b   Walsh, Phillip ^c   Evans, Glenn ^c  

^a APPLIED MATERIALS INC   (United States)

^b PHOTRONICS INC   (United States)

^c N and K Technology Inc   (United States)

Author keywords

Alternating Aperture Phase Shift Masks; Broadband Spectrophotometry; Lithography; Trench Depth Measurement

Indexed keywords

ATOMIC FORCE MICROSCOPY; ETCHING; FUSED SILICA; INTERFEROMETRY; PHASE SHIFT; PROFILOMETRY; REAL TIME SYSTEMS; SCANNING ELECTRON MICROSCOPY; SPECTROPHOTOMETRY;

APERTURE PHASE SHIFT MASKS;

MASKS;

EID: 0037628612     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.468212     Document Type: Conference Paper

References (6)

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6. R. Herrick, T. Pardue, and P. Walsh, "Accurate, Fast Measurement of Trench Depth in STI and Power Discreet Vertical MOSFET Devices Using Broadband Spectrophotometry", To be published.