Cr photomask etch performance and its modeling

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4889, Issue 1, 2002, Pages 667-678

  Wu, Banqiu ^a   Chan, David ^a  

^a PHOTRONICS INC   (United States)

Author keywords

Cr; Dry etch; Etch; Modeling; Plasma

Indexed keywords

DRY ETCHING; PHOTORESISTS; PLASMA APPLICATIONS; SCANNING ELECTRON MICROSCOPY;

PHOTOMASKS;

MASKS;

EID: 0037627703     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.467581     Document Type: Conference Paper

References (4)

1. G. Ruhl, R. Dietrich, R. Ludwig, N. Falk, T. Morrison, and B. Stoehr, "Optimizing the Chromium Dry Etch Process", Semiconductor International, July 2001, pp. 239-246, 2001.
2. C. Constantine, R. Westerman, and J. Plumhoff, "Plasma Etch of Binary Cr Masks: CD Uniformity Study of Photomasks Utilizing Varying Cr Loads", in the 19th Annual BACUS Symposium on Photomask Technology, Monterey, California, SPIE, vol. 3873, pp.93-97, 1999.
3. F. Chen, W. Tsai, S. Chegwidden, S. Yu, M. Kamna, J. Farnsworth, "Impact of the Loading Effect on CD Control in Plasma Etching of Cr Photomasks using ZEP7000 Resist", SPIE, vol. 3546, pp. 429-437, 1998.
4. R.J. Shul and S.J. Pearton, Eds., Handbook of Advanced Plasma Processing Techniques, Springer-Verlag, Berlin, Germany, pp.45-51 and pp. 260-263, 2000.