Light-emitting diode curing: Influence on selected properties of resin composites

Quintessence International

Volumn 34, Issue 1, 2003, Pages 71-75

  Asmussen, Erik ^a   Peutzfeldt, Anne ^a  

^a UNIVERSITY OF COPENHAGEN   (Denmark)

Author keywords

Degree of conversion; Flexural strength; Halogen curing unit; Light emitting diode curing unit; Photopolymerization; Polymerization contraction; Resin composite

Indexed keywords

HALOGEN; RESIN; BISPHENOL A BIS(2 HYDROXYPROPYL) ETHER DIMETHACRYLATE; DEFINITE COMPOSITE RESIN; FILTEK Z250; PERTAC HYBRID; POLYMER; SILOXANE; TERPENE;

ARTICLE; CHEMICAL MODIFICATION; ELASTICITY; FOURIER ANALYSIS; LIGHT EMITTING DIODE; PHYSICAL CHEMISTRY; POLYMERIZATION; YOUNG MODULUS; ANALYSIS OF VARIANCE; CHEMISTRY; COMPARATIVE STUDY; HUMAN; ILLUMINATION; INFRARED SPECTROSCOPY; INSTRUMENTATION; LIGHT; MATERIALS TESTING; MECHANICAL STRESS; PLIABILITY; RADIATION EXPOSURE; SURFACE PROPERTY;

ANALYSIS OF VARIANCE; BISPHENOL A-GLYCIDYL METHACRYLATE; COMPOSITE RESINS; ELASTICITY; HUMANS; LIGHT; LIGHTING; MATERIALS TESTING; PLIABILITY; POLYMERS; SILOXANES; SPECTROSCOPY, FOURIER TRANSFORM INFRARED; STRESS, MECHANICAL; SURFACE PROPERTIES; TERPENES;

EID: 0037607394     PISSN: 00336572     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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