Pb-free solder bumping for flip chip package by electroplating

Soldering & Surface Mount Technology

Volumn 15, Issue 2, 2003, Pages 10-16

  Hwang, Hyeon ^a   Hong, Soon Min ^a   Jung, Jae Pil ^b   Kang, Choon Sik ^c  

^a SAMSUNG Electronics   (South Korea)

^b University of Seoul   (South Korea)

^c Seoul National University   (South Korea)

Author keywords

Electroplating; Flip chip; Lead free soldering

Indexed keywords

ADHESION; CURRENT DENSITY; ELECTROPLATING; LEAD; SOLDERING;

SOLDER BUMPING;

CHIP SCALE PACKAGES;

EID: 0037591593     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910310479486     Document Type: Article

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