Micro-patterning of self-supporting layers with conducting polymer wires for 3D-chip interconnection applications

Applied Surface Science

Volumn 212-213, Issue SPEC., 2003, Pages 411-416

  Ackermann, J ^a   Videlot, C ^a   Nguyen, T N ^b   Wang, L ^b   Sarro, P M ^b   Crawley, D ^c   Nikolic K ^c   Forshaw, M ^c  

^a CNRS   (France)

^b DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^c UNIVERSITY COLLEGE LONDON   (United Kingdom)

Author keywords

Molecular interconnections; Patterning; Polymers; Self assembly

Indexed keywords

ANISOTROPY; CROSSTALK; ELECTROPOLYMERIZATION; SENSORS;

MOLECULAR WIRES;

POLYMERS;

EID: 0037566013     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(03)00418-5     Document Type: Conference Paper

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7. J. Ackermann, D. Crawley, M. Forshaw, K. Nikolic, C. Videlot, Surf. Sci., in press.