Comparison of microstructures in electroformed copper liners of shaped charges before and after plastic deformation at different strain rates

Materials Science and Engineering: A

Volumn 350, Issue 1-2, 2003, Pages 160-167

  Tian, W H ^a   Fan, A L ^a   Gao, H Y ^a   Luo, J ^b   Wang, Z ^b  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

^b UNIVERSITY OF TORONTO   (Canada)

Author keywords

Dynamic recovery and recrystallization; Electroformation; Electron backscattering Kikuchi pattern; Microtexture; Ultra high strain rate deformation

Indexed keywords

CRYSTAL DEFECTS; ELECTROFORMING; MICROSTRUCTURE; PLASTIC DEFORMATION; STRAIN RATE;

COPPER LINERS;

COPPER;

COPPER; ELECTROFORMING; MICROSTRUCTURE; PLASTIC DEFORMATION; STRAIN;

EID: 0037534844     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(02)00721-9     Document Type: Article

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