Electrodeposition method for terminals of multilayer ceramic capacitors

Journal of the American Ceramic Society

Volumn 86, Issue 6, 2003, Pages 905-909

  Van Trinh, Hung ^a   Talbot, Jan B ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERMETS; COPPER; DIELECTRIC MATERIALS; ELECTRIC PROPERTIES; ELECTRODES; ELECTROLESS PLATING; ELECTROLYSIS; ELECTROPLATING; MULTILAYERS; NICKEL PLATING; RELIABILITY;

ELECTRODEPOSITED TERMINAL CAPACITOR; ELECTROLYTIC NICKEL PLATING; ELECTROLYTIC PLATING; MULTILAYER CERAMIC CAPACITOR;

CERAMIC CAPACITORS;

EID: 0037531490     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1151-2916.2003.tb03395.x     Document Type: Article

References (11)

1. C. A. Harper, Handbook of Thick Film Hybrid Microelectronics. McGraw-Hill, New York, 1974.
2. R. P. Prassad, Surface Mount Technology Principles and Practice. Van Nostrand Reinhold, New York, 1989.
3. R. Singleton, "Barrel Plating"; pp. 340-59 in Metal Finishing Guidebook and Directory. Edited by M. Murphy, P. A. Frost, and C. Vollrath, Elsevier Science, Tarrytown, NY, 2001.
4. J. W. Dini, Electrodeposition, The Materials Science of Coatings and Substrates. Noyes Publications, New York, 1993.
5. C. F. Smith Jr., "End Termination Compositions for Multilayer Chip Capacitors: Platable Bases and Plating," Proc. - Electron. Compon. Conf., 37, 157-70 (1987).
6. R. D. Smith and B. B. Womack, "Ni Plating Induced Stress in MLCC Components," Proc. - Electron. Compon. Conf., 37, 171-74 (1987).
7. G. A. DiBari, "Nickel Plating"; pp. 270-88 in Metal Finishing Guidebook and Directory. Edited by M. Murphy, P. A. Frost, and C. Vollrath. Elsevier Science, Tarrytown, NY, 2001.
8. W. Chen, "Influence of Nickel Plating on Multilayer Ceramic Capacitor and the Implications for Reliability in Multilayer Ceramic Capacitors," J. Am. Ceram. Soc., 81 [10] 2751-52 (1998).
9. H. V. Trinh: M.S. Thesis, University of California, San Diego, CA, 2002.
10. F. S. Rudy, "Surface Preparation of Various Metals an Alloys Before Plating and Other Finishing Applications"; pp. 191-205 in Metal Finishing Guidebook and Directory. Edited by M. Murphy, P. A. Frost, and C. Vollrath, Elsevier Science, Tarrytown, NY, 2001.
11. Solderon LG Tech Spec 47460, LeaRonal Corp., Freeport, NY, 1989.