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Volumn 374, Issue , 2002, Pages 397-402
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The influence of thermal annealing in polymers employed in microelectronics
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Author keywords
MEMS; Microelectronics; Photoresist; Polymers
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Indexed keywords
ADHESION;
ANNEALING;
DEPOSITION;
DIFFERENTIAL SCANNING CALORIMETRY;
ELASTIC MODULI;
GLASS TRANSITION;
HEAT TREATMENT;
MICROELECTROMECHANICAL DEVICES;
MICROELECTRONICS;
PHOTORESISTS;
STRESSES;
THERMOANALYSIS;
FILM THICKNESS;
MEMS;
SUBSTRATE THICKNESS;
WAFER CURVATURE MEASUREMENT (WCM);
POLYMERS;
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EID: 0037520732
PISSN: 1058725X
EISSN: None
Source Type: Journal
DOI: 10.1080/10587250210479 Document Type: Conference Paper |
Times cited : (2)
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References (5)
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