Forced air cooling by using manifold microchannel heat sinks

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 1837-1842

  Pak, B C ^a   Chun, W C ^a   Baek, B J ^a   Copeland, D ^b  

^a Chonbuk National University   (South Korea)

^b Intricast   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0037495385     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (13)

1. Copeland, D., Takahira, H., Nakayama, W. and Pak, B.C., 1995, "Manifold Microchannel Heat Sinks : Theory and Experiment", Thermal Science & Engineering (Japan), Vol. 3, No. 2, pp. 9-15.
2. Goldberg, N., 1984, "Narrow Channel Forced Air Heat Sink," IEEE Trans. on Components, Hybrids, and Manufacturing Technology, Vol. 7, No. 1, pp. 154-159.
3. Gromoll, B., 1994, "Advanced Micro Air-cooling Systems for High Density Packaging," Proc. IEEE SEMI-THERMTM Symposium, pp. 53-58.
4. Harpole, G. M., and Eninger, J. E., 1991, "Micro-Channel Heat Exchanger Optimization," Proc. 7th IEEE Semi-Therm Symp. pp. 59-63.
5. ISO 5167-1, 1991, "Measurement of Fluid Flow by Means of Differential Pressure Devices", International Standards Organization.
6. Kleiner, M.B., Kuhn, S.A. and Haberger, K, 1995, "High Performance Forced Air Cooling Scheme Employing Microchannel Heat Exchangers," IEEE Transactions on Components, Packaging, and Manufacturing Technology - Part A, Vol. 18, No. 4, pp. 795-804.
7. Knight, R. W., Goodling, J. S., and Hall D.J., 1991, "Optimal Thermal Design of Forced Convection Heat Sinks - Anaylitical," ASME Trans., J. of Electronic Packaging, Vol. 113, pp. 313-321.
8. Knight, R.W., Hall, D.J., Goodling, J.S. and Jaeger, R.C., 1992a, "Heat Sink Optimization with Application to Microchannels," IEEE Trans. on Components, and Manufacturing Tech., Vol. CHMT-15, No.5, pp.832-842.
9. Knight, R. W., Goodling, J. S., and Gross, B. E., 1992b, "Optimal Thermal Design of Air Cooled Forced Convection Finned Heat Sinks - Experimental Verification," IEEE Trans. on Components, Hybrids, and Manufacturing Technology, Vol. 15, No. 5, pp. 754-760.
10. Phillips, R.J. , 1990, "Microchannel Heat Sinks," in Advances in Thermal Modeling of Electronic Components and Systems, Vol.3, ASME Press.
11. Schulenberg, N. et al., 1989, "Evaluation of Air-cooled Microchannel Heat Sinks", Proc. 9th Int. Electronics Packaging Conf., pp. 913-924.
12. Tuckerman, D. B., and Pease, R. F. W., 1981, "High-Performance Heat Sinking for VLSI," IEEE Electron Device Letters, Vol. 2, No. 5, pp. 126-129.
13. Yu, S.-P., and Xin, M.-D., 1994, "Analysis and Experiment on Gas Convection Microchannel Heat Exchangers", Proc. the 10th International Heat Transfer Conference, Vol. 4, pp. 459-464.