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Volumn 163-164, Issue , 2003, Pages 668-673
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Investigating ion nitriding for the reduction of dissolution and soldering in die-casting shot sleeves
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Author keywords
Adhesion; Dissolution; Nitriding; Shot sleeve; Soldering; Wettability
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Indexed keywords
ADHESION;
SOLDERING;
SURFACE PHENOMENA;
WETTING;
CHEMICAL DISSSOLUTION;
DIE CASTING MACHINES;
DIECASTING;
DISSOLUTION;
NITRIDING;
SOLDER;
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EID: 0037472722
PISSN: 02578972
EISSN: None
Source Type: Journal
DOI: 10.1016/S0257-8972(02)00693-X Document Type: Article |
Times cited : (39)
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References (8)
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