Densification and dielectric properties of barium neodymium titanium oxide ceramics

Materials Science and Engineering: B

Volumn 98, Issue 1, 2003, Pages 33-37

  Lu, Chung Hsin ^a   Huang, Yung Hsiang ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Barium; Densification; Dielectrics; Microstructure; Neodymium; Oxide; Titanium

Indexed keywords

BALL MILLING; BARIUM COMPOUNDS; CALCINATION; DENSIFICATION; DIELECTRIC MATERIALS; DIELECTRIC PROPERTIES; DOPING (ADDITIVES); MICROSTRUCTURE; SINTERING;

LIQUID-PHASE SINTERING;

CERAMIC MATERIALS;

EID: 0037465410     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5107(02)00593-7     Document Type: Article

References (20)

1. Sreemoolanadhan H., Sebastian M.T., Mphanan P. Brit. Ceram. Trans. 95:1996;79.
2. Wakino K., Nishikawa T., Ishikawa Y. Brit. Ceram. Trans. J. 89:1990;39.
3. Chen X.M., Yang J.S. J. Eur. Ceram. Soc. 19:1999;139.
4. Mercurio J.P., Manier M., Frit B. Mater. Lett. 8:1989;112.
5. Silva A., Azough F., Freer R., Leach C. J. Eur. Ceram. Soc. 20:2000;2727.
6. Kajfez D., Guillon P. Dielectric Resonators. 1986;Artech House, Norwood, MA.
7. Nenasheva E.A., Kartenko N.F. J. Eur. Ceram. Soc. 21:2001;2697.
8. Chen X.M., Suzuki Y., Sato N. Mater. Lett. 16:1993;75.
9. Kolar D., Gaberscek S., Volavsek B. J. Solid State Chem. 38:1981;158.
10. Ohsato H., Nishigaki S., Okuda T. Jap. J. Appl. Phys. 31:1992;3136.
11. Choi J.H., Kim J.H., Lee B.T., Kim Y.M., Moon J.H. Mater. Lett. 44:2000;29.
12. Yamada A., Utsumi Y., Watarai H. Jap. J. Appl. Phys. 30:1991;2350.
13. Chen X.M., Suzuki Y., Sato N. J. Mater. Sci.-Mater. El. 6:1995;10.
14. Hennings D.F.K. J. Eur. Ceram. Soc. 21:2001;1637.
15. Lu C.H. J. Am. Ceram. Soc. 77:1994;2529.
16. Lu C.H., Hwang W.S. J. Ceram. Soc. Jap. 104:1996;587.
17. Lu C.H., Chen Y.C. J. Euro. Ceram. Soc. 19:1999;2909.
18. Nielsen E.R., Ringgaard E., Kosec M. J. Eur. Ceram. Soc. 22:2002;1847.
19. Rhim S.M., Bak H., Hong S., Kim O.K. J. Am. Ceram. Soc. 83:2000;3009.
20. Huang C.L., Weng M.H., Lion C.T., Wu C.C. Mater. Res. Bull. 35:2000;2445.