Cu-filled carbon nanotubes by simultaneous plasma-assisted copper incorporation

Applied Physics Letters

Volumn 82, Issue 12, 2003, Pages 1926-1928

  Zhang, G Y ^a   Wang, E G ^a  

^a INSTITUTE OF PHYSICS   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROCHEMICAL ELECTRODES; ELECTRON DIFFRACTION; GROWTH (MATERIALS); MICROWAVES; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; TRANSMISSION ELECTRON MICROSCOPY; TUNGSTEN;

HIGH-RESOLUTION TRANSMISSION ELECTRON MICROSCOPE (HRTEM);

CARBON NANOTUBES;

EID: 0037464208     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1562341     Document Type: Article

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