Toughness response of vinylester/epoxy-based thermosets of interpenetrating network structure as a function of the epoxy resin formulation: Effects of the cyclohexylene linkage

Journal of Applied Polymer Science

Volumn 88, Issue 8, 2003, Pages 2124-2131

  Karger Kocsis, J ^a   Gryshchuk, O ^a   Jost, N ^a  

^a INSTITUT FÜR VERBUNDWERKSTOFFE GMBH   (Germany)

Author keywords

Epoxy resin; Fractography; Fracture mechanics; Interpenetrating network (IPN); Vinylester resin

Indexed keywords

ATOMIC FORCE MICROSCOPY; CHARACTERIZATION; CROSSLINKING; CURING; DYNAMIC MECHANICAL ANALYSIS; EPOXY RESINS; FRACTOGRAPHY; FRACTURE MECHANICS; FRACTURE TOUGHNESS; SCANNING ELECTRON MICROSCOPY; THERMOANALYSIS; THERMOSETS; VINYL RESINS;

FRACTURE ENERGY;

INTERPENETRATING POLYMER NETWORKS;

EPOXY RESIN; FRACTURE; STRENGTH;

EID: 0037462143     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/app.11946     Document Type: Article

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