Mechanical behaviour and the evolution of the dislocation structure of copper polycrystal deformed under fatigue-tension and tension-fatigue sequential strain paths

Materials Science and Engineering: A

Volumn 348, Issue 1-2, 2003, Pages 133-144

  Jia, W P ^a,b   Fernandes, J V ^a  

^a UNIVERSITY OF COIMBRA   (Portugal)

^b INSTITUTE OF METAL RESEARCH   (China)

Author keywords

Dislocation structure; Fatigue; Polycrystal; Strain path change; Tension

Indexed keywords

DEFORMATION; DISLOCATIONS (CRYSTALS); FATIGUE OF MATERIALS; GRAIN SIZE AND SHAPE; HARDENING; MICROSTRUCTURE; TRANSMISSION ELECTRON MICROSCOPY;

FATIGUE-TENSION TESTS;

POLYCRYSTALLINE MATERIALS;

COPPER;

EID: 0037447669     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(02)00630-5     Document Type: Article

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